International Affairs

Summer Program

Tohoku University Engineering Summer Program 2017 (TESP 2017)

TESP is designed to inspire graduate level students in the field of Engineering. The program provides a series of lectures and hands-on activities on the advanced topics, all are taught in English. In addition, the program includes various activities that expose the participants to Japanese culture and enrich their academic experience. The program overall promises students that the summer will be a rich academic and cultural experience and gives them an insight for their academic future and their future as a global citizenship.

Course:

Robotics course

  • Core Lectures:
    11 slots of 1.5 hours lectures on the following topics: Field and Space Robotics, Rescue Robotics, Human-Robot Interaction, Haptic Interface, Robot Vision, Medical Robotics, Molecular-size Robotics, Biologically Inspired Robotics (students are expected to attend all lectures.)
  • Hands-on Activities:
    Selective from the following topics: Field and Space Robotics, Human-Robot Interaction, Haptic Interface, Robot Vision, Molecular-size Robotics

Electrical and Electronic Engineering Course

  • Laboratory visit and experience:
    Laboratory of Microphotonics
    Laboratory of Wireless Information Technology
    Laboratory of Electromagnetic Engineering
  • Hands-on Activities:
    Design and make a prototype of a smart wireless power transfer system which can generate the solar electric power and transfer the power wirelessly to the electric devices.

Structural Materials Engineering Course

  • Core Lectures:
    Alloy Design and Synthesis by Arc Melting, Spark-Plasma Sintering and 3D Printing, Microstructure Observation and Analysis by Optical and Electron Microscopy and X-ray Diffractometry, Mechanical Property Measurement by Nano-Indentation, Vickers Hardness, Tensile and Compression Tests
  • Classes:
    Phase Diagrams, Plastic Deformation and Dislocation Theory, High-Temperature Materials, Introduction of Bulk Metallic Glasses Introduction of Power Processing, etc.

Date:

July 24th – August 4th,2017

Location:

Aobayama campus, Tohoku University, Sendai, Japan

Application Deadline:

April, 28th, 2017 (JST15:00)

Fee:

15,000 JPY

Contact:

Coordinator: Fang Han
Email: tesp@grp.tohoku.ac.jp
Phone & Fax: +81-22-795-7996

Links:

International Affairs

International Affairs