Tohoku University Engineering Summer Program 2018 (TESP 2018)
TESP is designed to inspire engineering students from partner universities. The program provides a series of lectures and hands-on activities on the advanced topics, all are taught in English. In addition, the program includes various activities that expose the participants to Japanese culture and enrich their academic experience. The program overall promises students that the summer will be a rich academic and cultural experience and gives them an insight for their academic future and their future as a global citizenship.
Electrical and Electronic Engineering Course
Structural Materials Engineering Course
Bio-Materials Engineering Course【New】
- * The eligibility, program structure etc. vary by courses.
- * TESP is only open to designated partner university.
July 30th – August 10th, 2018
Aobayama campus, Tohoku University, Sendai, Japan
April 27th, 2018 (JST15:00)
Phone & Fax: +81-22-795-7996